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/ Applications / BGA Inspection

BGA Inspection

For manufacturers in the electronics industry requiring reliable and accurate BGA (Ball Grid Array) inspection, the C6-3070CS not only provides the required precision but also speed and efficiency. With this sensor, quality assurance is taken to a new level.
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Precise BGA Inspection in the Electronics Industry

The inspection of Ball Grid Arrays (BGA) is a critical quality control measure in the electronics industry. AT – Automation Technology has developed the C6-3070CS 3D profile sensor specifically for this task.

Challenge

BGA inspection requires extremely accurate and fast sensors to quickly detect even the smallest deviations and defects. Furthermore, detailed evaluation of the 3D point cloud is essential for comprehensive quality assurance.

Solution

The C6-3070CS 3D profile sensor from AT offers the world’s fastest 3D sensor technology in terms of resolution and speed. Its on-chip processing enables direct data processing on the sensor, leading to faster result output. Unique features such as MultiPart and MultiPeak enable detailed evaluation of the 3D point cloud, ensuring even more precise BGA inspection.

Your Benefits

High-Speed
World’s fastest 3D sensor technology in terms of resolution and speed for fast and precise inspections.
Unique Sensor Chip
On-chip processing for rapid results and reduced processor load.
Unique Features
Unique features like MultiPart and MultiPeak enable detailed evaluation of the 3D point cloud, increasing inspection accuracy.
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